Taipei, Taiwan

Nien-Tien Cheng

This inventor holds 21 USPTO granted patents, primarily in Heat Dissipation Technology. Top assignees: Foxconn Technology Co., Ltd., Furui Precise Component (Kunshan) Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2008-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nien-Tien Cheng. Retrieved from https://idiyas.com/inventor/nien-tien-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 57(Granted Patents)


Location History:

  • Tu-Cheng, TW (2008 - 2010)
  • Taipei Hsien, TW (2010 - 2014)
  • New Taipei, TW (2013 - 2016)

Company Filing History:


Years Active: 2008-2016

Loading Chart...
Areas of Expertise:
Heat Pipe
Heat Dissipation
Thermal Interface Material
Cooling Assembly
Injection Molding
Portable Electronic Device
Thermal Module
Manufacturing Method
Wick Structure
Mold Design
Guiding Lines
Notebook Computer
21 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Nien-Tien Cheng

Introduction

Nien-Tien Cheng is a notable inventor based in Taipei Hsien, Taiwan, recognized for his significant contributions to the field of thermal management solutions. With an impressive portfolio of 21 patents, Cheng has made strides in the development of advanced heat pipe technologies, which play a crucial role in various engineering applications.

Latest Patents

Among Cheng's latest innovations is the patented flat heat pipe. This exemplary device features a hollow, flattened casing designed to enhance heat dissipation efficiency. It incorporates a first wick structure formed by woven wires and a second wick structure made from sintered metal powder. The design facilitates the interaction between these structures, which are strategically placed against the inner sides of the casing's top and bottom plates. The creation of vapor channels on both lateral sides of the wick structures optimizes the overall heat transfer performance.

Another notable patent from Cheng is the heat dissipating assembly integrated within a mold. This assembly comprises an angular pin and a heat pipe, coupled with a liquid passage that runs through the angular pin’s receiving chamber. The innovative design ensures effective cooling through a well-defined evaporation and condensing section within the mold, significantly improving the mold's operational efficiency.

Career Highlights

Nien-Tien Cheng has garnered experience through his work with reputable companies such as Foxconn Technology Co., Ltd. and Furui Precise Component (Kunshan) Co., Ltd. His tenure at these organizations showcases his ability to apply innovative concepts in real-world manufacturing settings, ultimately leading to the advancement of thermal technologies.

Collaborations

Throughout his career, Cheng has engaged in collaborations with several skilled professionals, including Chen-Shen Lin and Ming-Tang Zhang. These partnerships have facilitated a dynamic exchange of ideas and complementing expertise, fostering further innovation within their shared fields of interest.

Conclusion

Nien-Tien Cheng's dedication to innovation and invention has propelled him to the forefront of thermal technology development. His contributions, particularly in the realm of heat pipes and thermal management systems, continue to influence various industries, marking him as a pivotal figure in modern engineering advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…