The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Jul. 20, 2009
Applicants:

Jui-wen Hung, Taipei Hsien, TW;

Nien-tien Cheng, Taipei Hsien, TW;

Ping-yang Chuang, Taipei Hsien, TW;

Inventors:

Jui-Wen Hung, Taipei Hsien, TW;

Nien-Tien Cheng, Taipei Hsien, TW;

Ping-Yang Chuang, Taipei Hsien, TW;

Assignee:

Foxconn Technology Co., Ltd., Tucheng, Taipei County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.


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