For the Inventor, By the Inventor

Enter assignee name

New Taipei, Taiwan

Foxconn Technology Co., Ltd.

USPTO Granted Patents = 1,231

% Expired Patents = 78.7

Forward Citations = 12,607

Loading Chart...

Loading Chart...

470 inventors (with patents filed for the assignee):

Chun-Chi Chen (120 out of 151 patents)

Tay-Jian Liu (110 out of 111 patents)

Shih-Hsun Wung (76 out of 78 patents)

4. Guang Yu (75 out of 76 patents)

5. Cheng-Tien Lai (72 out of 96 patents)

6. Chuen-Shu Hou (69 out of 70 patents)

7. Shi-Song Zheng (65 out of 65 patents)

8. Chin-Chung Chen (61 out of 62 patents)

9. Chao-Nien Tung (58 out of 60 patents)

10. Ching-Bai Hwang (57 out of 62 patents)

11. Li He (55 out of 85 patents)

12. Shi-Wen Zhou (55 out of 59 patents)

13. Zhi-Yong Zhou (53 out of 69 patents)

14. Yong-Dong Chen (51 out of 51 patents)

15. Chin-Long Ku (41 out of 49 patents)

Core Competencies:

Heat Dissipation Fan

Cooling Fan

Heat Pipe

LED Lamp

Electronic Device

Metallic Housing

Heat Sink

Wireless Charging

Centrifugal Fan

Thermal Module

Charging Battery Unit

Fan Assembly

1,231 patents: Sort by Forward Citations

1. 12352285 - Impeller for heat dissipation fan, heat dissipation fan having the same and electronic device (2025-07-08),

2. 12267036 - Method and system for controlling fan, and electronic device employing method (2025-04-01),

3. 12076771 - Metal shell and manufacturing process method thereof (2024-09-03),

4. D1036381 - Motor cover (2024-07-23),

5. 10124405 - Manufacturing method for metallic housing of electronic device (2018-11-13),

6. 10040120 - Manufacturing method for metallic housing of electronic device (2018-08-07),

7. 9842791 - Base with heat absorber and heat dissipating module having the base (2017-12-12),

8. 9748161 - Heat dissipation device (2017-08-29),

9. 9717162 - Electronic device and heat dissipating casing thereof (2017-07-25),

10. 9689625 - Heat pipe (2017-06-27),

11. 9657741 - Magnet case and rotor incorporating the same (2017-05-23),

12. 9624935 - Cooling fan with rotor shaft end abutting polyoxymethylene tube bottom (2017-04-18),

13. 9581324 - LED illumination device having a heat sink with a plurality of sets of fins defining air tunnels of different sizes (2017-02-28),

14. 9546667 - Fan with metallic hub and plastic impeller and method for manufacturing such fan (2017-01-17),

15. 9537523 - Cover of a handheld electronic device (2017-01-03),

Company Overview

Foxconn Technology Co., Ltd., headquartered in New Taipei, Taiwan, is a leading manufacturer specializing in heat dissipation technology. The company focuses on developing advanced solutions such as heat dissipation fans, cooling fans, heat pipes, and heat sinks, which are essential for maintaining optimal performance in electronic devices. Additionally, Foxconn is involved in the production of LED lamps and metallic housings, as well as innovations in wireless charging technology, positioning itself at the forefront of thermal management in electronics.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

1,231 Patents

#7 in New Taipei

#31 in Taiwan

#827 in the World

New Taipei, Taiwan

Foxconn Technology Co., Ltd.

Forward Citations = 12,607

470 inventors:

Chun-Chi Chen (120 out of 151 patents)

Tay-Jian Liu (110 out of 111 patents)

Shih-Hsun Wung (76 out of 78 patents)

4. Guang Yu (75 out of 76 patents)

5. Cheng-Tien Lai (72 out of 96 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Foxconn Technology Co., Ltd.. Retrieved from https://idiyas.com/company/foxconn-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…