Taipei, Taiwan

Cheng-Tien Lai

This inventor holds 96 USPTO granted patents, primarily in LED Heat Dissipation (CPC class H05K7-20). Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.. Active years: 2002-2013.


% Patents Active = 9.4

Average Co-Inventor Count = 2.9

ph-index = 19

Forward Citations = 1,224(Granted Patents)

Forward Citations (Not Self Cited) = 1,200(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Santa Clara, CA (US) (2006)
  • Tu-Chen, TW (2002 - 2009)
  • Guangdong, CN (2007 - 2009)
  • Fullerton, CA (US) (2009)
  • Tu-Cheng, TW (2006 - 2010)
  • Taipei Hsien, TW (2008 - 2013)

Company Filing History:


Years Active: 2002-2013

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Areas of Expertise:
LED Lamp
Heat Sink
Heat Dissipation
Liquid Cooling
Vapor Chamber
Heat Pipes
LED Module
Thermal Management
Heat Spreader
Light Guiding Module
Protective Packaging
Miniature Cooling Device
96 patents (USPTO):Explore Patents

Title: Innovations by Cheng-Tien Lai: A Focus on Illumination and Heat Dissipation

Introduction

Cheng-Tien Lai, a prominent inventor based in Taipei Hsien, Taiwan, has an impressive portfolio with a total of 96 patents to his name. His work primarily revolves around innovative solutions in illumination and heat management technologies, marking significant advancements in the field.

Latest Patents

Two of Cheng-Tien Lai's latest patents showcase his ingenuity in creating effective and efficient device designs. The first patent, titled "Illumination Device with Heat Dissipation Structures," details an exemplary illumination device that incorporates an enclosure housing a semiconductor light source. This innovative device projects light generated from multiple independent light source modules through a protective envelope. A unique feature of this design is the inclusion of numerous air passages in each module, allowing for efficient heat dissipation into the ambient air, ensuring optimal performance and longevity of the light source.

The second patent, "Heat Sink with Heat Pipes," presents an advanced cooling solution for electronic components. This patent describes a heat sink adapter consisting of a lower and upper plate, along with both upper and lower fin sets fixed between them. The ingenious design incorporates S-shaped heat pipes that are juxtaposed, providing effective heat transfer and management. This innovative approach enhances cooling efficacy, making the electronic components more reliable and performance-driven.

Career Highlights

Cheng-Tien Lai has made significant contributions to the tech industry through his employment at notable companies such as Foxconn Technology Co., Ltd. and Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. His experience in these organizations has provided him with valuable insights and a robust platform to innovate in the fields of electronics and illumination technologies.

Collaborations

Throughout his career, Cheng-Tien Lai has had the opportunity to collaborate with talented professionals, including Zhi-Yong Zhou and Guang Yu. These collaborations have fostered an environment of creativity and technological advancement, resulting in several successful innovations and patents.

Conclusion

Cheng-Tien Lai's extensive portfolio of patents and his innovative approach to illumination and electronic cooling technologies reflect his dedication to improving the efficiency and functionality of everyday devices. His impactful contributions signify not only his personal achievements but also a commitment to advancing technological standards in the industry.

Profile summary based on public USPTO records.
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