Tucheng, Taiwan

Hsieh Kun Lee

This inventor holds 68 USPTO granted patents, primarily in Heat Dissipation Technology (CPC class H05K). Top assignees: Hon Hai Precision Industry Co., Ltd., Foxconn Precision Components Co., Ltd., Foxconn Technology Co., Ltd.. Active years: 1999-2008.


% Patents Active = 23.5

Average Co-Inventor Count = 2.5

ph-index = 16

Forward Citations = 796(Granted Patents)

Forward Citations (Not Self Cited) = 781(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Chung-Ho, TW (1999 - 2002)
  • Taipei, TW (2002 - 2003)
  • Shenzhen, CN (2002 - 2006)
  • Tu-chen, TW (2003 - 2008)
  • Santa Clara, CA (US) (2006 - 2008)

Company Filing History:


Years Active: 1999-2008

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Areas of Expertise:
Heat Sink
Liquid Cooling
Heat Dissipation
Fan Mounting
Interlocking Fin Plates
Thermal Management
Retention Module
Cammed Handle
Fasteners
Airflow Guiding
Heat Pipe
Assembly
68 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Hsieh Kun Lee in Patent Development

Introduction: Hsieh Kun Lee, based in Tu-Chen, Taiwan, is a prolific inventor with an impressive portfolio of 68 patents. His work focuses on creating innovative solutions that enhance technology performance and efficiency. His contributions have significantly impacted the fields of mechanical devices and component assemblies.

Latest Patents: Two noteworthy patents attributed to Hsieh Kun Lee are the “Mounting Device for Fans” and the “Heat Sink Clip with Cammed Handle.” The Mounting Device for Fans addresses the efficient assembly of multiple fans within a server chassis. It consists of a tray equipped with pairs of mounting sections complementing U-shaped brackets, allowing secure placement of fans using coaxial locking systems. This invention not only ensures optimal fan placement but also maintains airflow efficiency.

Another key patent is the Heat Sink Clip with Cammed Handle, which innovatively integrates a main body, post, spring, and handle to securely engage with socket catches. This clip enhances assembly operations, making it easier and quicker for users to manage heat sinks, which are critical for maintaining optimal operating temperatures in devices.

Career Highlights: Hsieh Kun Lee’s career includes significant contributions while working with reputable companies such as Hon Hai Precision Industry Co., Ltd. and Foxconn Precision Components Co., Ltd. His professional journey in these organizations has contributed to cutting-edge technological advancements and operational efficiencies, solidifying his reputation as a key player in the innovation landscape.

Collaborations: Throughout his career, Hsieh Kun Lee has collaborated with notable coworkers including Cheng-Tien Lai and Dongyun Lee. Their collective expertise and teamwork have fostered an environment conducive to groundbreaking inventions and patent applications, further enhancing their contributions to the tech industry.

Conclusion: Hsieh Kun Lee stands out as an influential inventor whose work in the realm of patents has led to significant advancements in technology. With his remarkable portfolio of patents and collaborations with industry professionals, he continues to drive innovation forward, shaping the future of technological solutions.

Profile summary based on public USPTO records.
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