Hon Hai Precision Industry Co., Ltd.

Foxconn Precision Components Co., Ltd.

Foxconn Technology Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Other

Hsieh Kun Lee

Cheng-Tien Lai

Dongyun Lee

Wanlin Xia

Tao Li

Wellint Xia

Chun-Chi Chen

Zhijie Zhang

Gen-Cai Wang

Cui Jun Lu

Jin Song Feng

Wan-Lin Xia

HeBen Liu

Gencai Wang

Toly Lee

Shi-Wen Zhou

Lei Li

Xue-Wen Peng

Shi Zhou

Zhi Sheng Lin

MingXian Sun

Wan Lin Xia

He-Ben Liu

Donyun Lee

Shi Wen Zhou

Zhi-Yong Zhou

Meng Fu

Yu-Ming Ho

Jianjun Zhang

Cui-Jun Lu

Fei Huang

Zhigang Liu

Jin-Song Feng

Yi Wu

Ai-Min Huang

Chin Hsien Lan

Ming Sun

Zhi-Bin Tan

Tony Zhou

Zhi Yong Zhou

Alan Zhou

Cuijun Lu

Herney Zhu

Meng Tzu Lee

Winsan Peng

ZhiSheng Lin

Hong Bo Shi

Don-Yun Lee

A mounting device, for mounting a plurality of fans () to a server chassis (), includes a tray (), a plurality of brackets (), and a plurality of fasteners (). The tray includes a plurality of pairs of mounting sections each pair fixed with a corresponding bracket. Each bracket is U-shaped and includes a pair of side plates () for sandwiching a corresponding fan therebetween. Each bracket defines a pair of coaxial locking holes (') in the side plates. Each fastener includes a pair of locking ends () received in the locking holes of a corresponding bracket to thereby sandwich the corresponding fan in the bracket. Each side plate defines an outlet () having a contour corresponding to a contour of an outlet of a corresponding fan, and each mounting section of the tray has a contour corresponding to a contour of the outlet of a corresponding fan.

Mounting device for fans

A heat sink clip () includes a main body (), a post (), a spring () and a cammed handle (). The main body includes a horizontal portion () and two locking arms (). A locking hole () is defined in an end of each locking arm for engaging with catches () of a socket (). The post has a pressing block () at a bottom portion and a cutout () at a top portion. The spring is placed around the post and rests on the pressing block The post extends through a through aperture () of the horizontal portion, and the cutout pivotally receives a cam () at one end of the handle. When the handle is pressed, the horizontal portion of the main body is raised by the decompressed spring, so that the locking arms tightly engage with the catches of the socket.

Heat sink clip with cammed handle

A heat sink assembly of the present invention includes a printed circuit board (), a retention module (), four pins (), a heat sink () and a clip (). The printed circuit board () has an electronic package () mounted thereon. The retention module () is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module () defines an opening () therein for surrounding the electronic package (). Four positioning holes () are defined in four corners of the retention module (). In assembly of the heat sink assembly, the pins () are interferentially positioned in the positioning holes () of the retention module (). Portions of the pins () extending out beyond the retention module () are welded to the printed circuit board (). The clip () cooperates with the retention module () to press the heat sink () against the electronic package ().

Heat sink assembly with retention module and clip

A radiator includes a flat base (), a pair of heat pipes () and a plurality of fins () on the base. The base defines a pair of grooves () through a top portion thereof. Each heat pipe includes parallel and symmetrical first and second sections (). The first sections are soldered to the base in the grooves. Each fin defines a notch () at a bottom portion thereof and a pair of holes () at opposite sides of the notch. Flanges () extend perpendicularly from the notches of the fins, cooperatively defining a streamline airflow guiding surface. Collars () extend perpendicularly from the holes of the fins, for receiving the second sections of the heat pipes.

Radiator with streamline airflow guiding structure

A heat dissipation device includes a plurality of fin plates () and a pair of heat pipes (). Each fin plate includes a first plate () and a second plate (). The first plate forms a first fastener () at an edge thereof and a pair of cutouts () at opposite sides of the fastener. A pair of tabs () is formed at opposite sides of the first fastener and parallel to the first plate. The second plate forms a second fastener () at an edge thereof. The second fastener includes a pair of double-layer latches () received in the cutouts of the first plate and interengaged with the tabs of the first plate. The first fastener is located between the pair of latches. The heat pipes are inserted through the first and second plates between said edges. The first and second plates then abut each other at said edges.

Heat dissipation device with interlocking fin plates

A heat dissipation device () includes a heat dissipation member (), a positioning member () and a mating member (). The heat dissipation member includes a fin set () and a post () in the fin set. The post extends through the positioning member and is mated with the mating member so that the positioning member is positioned between the fin set and the mating member.

Heat dissipation device

A heat dissipation device includes a first heat sink () mounted on one side of a video graphics adapter (VGA) card () on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink () mounted on an opposite side of the card, a pair of heat pipes () independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers () attached on the respective first and second heat sinks to form enclosed channels () between the covers and the first and second heat sinks respectively, a pair of fans () mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.

A heat sink assembly includes a heat sink () and a pair of clips () attached on opposite sides of the heat sink for securing the heat sink to an electronic component (). The heat sink includes a base () and a plurality of fins (). A pair of protrusions () is formed on bottom portions of adjacent two fins. A locking slot () is therefore formed between the base, the two adjacent fins, and the protrusions. The clip includes a pressing portion () squeenzedly received in the locking slot, a pair of extension portions () extending from opposite ends of the pressing portion, and a pair of hooks () formed on free ends of the extension portions. When the clips are deformed to cause the hooks to engage with the electronic component, the pressing portions of the clips press the heat sink toward the electronic component.

Heat sink assembly incorporating spring clip

A fastener () for mounting a heat-radiator () to an electronic device () on a circuit board () is disclosed. The heat-radiator and the circuit board have aligned holes (). The fastener includes a head () having an upper portion () with a large diameter and a lower portion () with a smaller diameter, a cylindrical spring () captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire () having a first end portion fixed on said head and a second end portion bent to form an engaging portion (). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Fastener for mounting heat-radiator to electronic device

A mounting device () for mounting a heat sink () to a circuit board (), includes a locking member () extending through the heat sink and including a through hole () and barbs () formed in one end portion thereof for engaging with the circuit board, an operation member () including a cylinder () and a rod () extending from the cylinder into the through hole of the locking member. First and second bumps () are formed in the locking member, and a pair of slots () is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring () is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Mounting device for heat sink

A liquid cooling system includes a container () defining communicable first and second chambers () therein, a pump () mounted on the container and having an entrance port () in flow communication with the second chamber, and an exit port () in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit () located at the loop for cooling the coolant.

Integrated liquid cooling system for electronic components

A liquid cooling system includes a cooling body () defining an hollow portion receiving a pump () and a number of cooling fins () therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet () and an outlet () both in communication with the passageway. The pump defines an exit () and an entrance () connected to the inlet and the outlet of the cooling body respectively by two tubes (). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.

Integratied liquid cooling system for electrical components

A heat dissipation device includes a mounting plate () for mounting the heat dissipation device to a circuit board () on which a CPU () and a plurality of capacitors () are mounted, a heat sink (), a core (), and a fan () mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder () and a plurality of curved fins () extending outwardly from the cylinder. The core includes a base () for contacting the CPU and a post () extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings () for providing access for cooled air from the fan to the CPU and the capacitors.

A heat dissipation device assembly includes a heat sink () placed on an electronic component () which is mounted on a printed circuit board (PCB) () and including a pair of shoulders () on opposite sides thereof, a pressing part () including a pair of pressing portions () supported on the shoulders and a pair of locking portions () spaced from the shoulders, a sliding part () slidably attached to the pressing part and including a pair of locking portions () spaced from the shoulder, and a back plate () mounted below the PCB and including four posts () extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening () including an entrance () and a locking slot (), the post being capable of extending through the entrance to engage in the locking slot.

Heat dissipation device assembly incorporating retention member

A heat dissipating device incorporating heat pipes includes a heat sink (), a first heat pipe () and a second heat pipe (). The heat sink has a first base (), a second base () and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end () and a heat-dissipation end (). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.

Heat dissipating device incorporating heat pipe

Growing community of inventors

Tu-Chen, Taiwan

Hsieh Kun Lee