The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Jul. 28, 2003
Hsieh Kun Lee, Tu-Chen, TW;
Wanlin Xia, Shenzhen, CN;
Gen-cai Wang, Shenzhen, CN;
Tao LI, Shenzhen, CN;
Hsieh Kun Lee, Tu-Chen, TW;
WanLin Xia, Shenzhen, CN;
Gen-Cai Wang, Shenzhen, CN;
Tao Li, Shenzhen, CN;
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, TW;
Abstract
A heat sink assembly of the present invention includes a printed circuit board (), a retention module (), four pins (), a heat sink () and a clip (). The printed circuit board () has an electronic package () mounted thereon. The retention module () is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module () defines an opening () therein for surrounding the electronic package (). Four positioning holes () are defined in four corners of the retention module (). In assembly of the heat sink assembly, the pins () are interferentially positioned in the positioning holes () of the retention module (). Portions of the pins () extending out beyond the retention module () are welded to the printed circuit board (). The clip () cooperates with the retention module () to press the heat sink () against the electronic package ().