The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Jul. 27, 2004
Hsieh Kun Lee, Tu-Chen, TW;
Wan-lin Xia, Shenzhen, CN;
He-ben Liu, Shenzhen, CN;
Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, TW;
Abstract
A heat dissipation device includes a mounting plate () for mounting the heat dissipation device to a circuit board () on which a CPU () and a plurality of capacitors () are mounted, a heat sink (), a core (), and a fan () mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder () and a plurality of curved fins () extending outwardly from the cylinder. The core includes a base () for contacting the CPU and a post () extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings () for providing access for cooled air from the fan to the CPU and the capacitors.