The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Sep. 21, 2004
Applicants:
Hsieh Kun Lee, Tu-Chen, TW;
Cheng-tien Lai, Tu-Chen, TW;
Shi-wen Zhou, Shenzhen, CN;
Inventors:
Assignee:
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat dissipation assembly of the present invention includes a printed circuit board (), an electronic component () mounted on the printed circuit board, a heat dissipation device () mounted on the electronic component, four securing members () secured to the heat dissipation device and four positioning members () extend through the printed circuit board. The positioning members are covered over by four resilient members () disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.