The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Apr. 28, 2015
Applicant:

Foxconn Technology Co., Ltd., New Taipei, TW;

Inventor:

Wei-Hang Hsu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/367 (2013.01); H01L 23/4006 (2013.01); F28D 2021/0029 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4068 (2013.01);
Abstract

A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.


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