The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Mar. 29, 2016
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., New Taipei, TW;
Cai-Hua Wang, Shenzhen, CN;
Yue-Jian Li, Shenzhen, CN;
Chen-Shen Lin, New Taipei, TW;
Wen-Hsiung Chang, New Taipei, TW;
Chun-Jung Chang, New Taipei, TW;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., New Taipei, TW;
Abstract
A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.