Company Filing History:
Years Active: 2016-2018
Title: Innovations by Inventor Cai-Hua Wang
Introduction
Cai-Hua Wang is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronic device manufacturing, holding a total of 5 patents. His innovative approaches have led to advancements in the production of metallic housings for electronic devices.
Latest Patents
Cai-Hua Wang's latest patents include a manufacturing method for a metallic housing of an electronic device. This method involves providing a die-casting mold that includes a male die and a female die. The process begins with positioning an outer frame in the cavity of the female die, which features a plurality of latching portions and grooves. The male die is then assembled to the female die, and pressured molten metal-alloy is cast into the cavity to form an inner structural member embedded in the outer frame. The method also includes disassembling the male die and removing the outer frame along with the inner structural member from the female die. Another patent details a similar manufacturing method, emphasizing the use of a metallic outer case as an insert during the casting process.
Career Highlights
Cai-Hua Wang has worked with notable companies such as Fu Zhun Precision Industry Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics sector.
Collaborations
Throughout his career, Cai-Hua Wang has collaborated with talented individuals, including coworkers Yue-Jian Li and Chen-Shen Lin. These collaborations have fostered a creative environment that has led to the development of cutting-edge technologies.
Conclusion
Cai-Hua Wang's contributions to the field of electronic device manufacturing are noteworthy. His innovative patents and career experiences highlight his role as a significant inventor in the industry.