The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Sep. 14, 2009
Heat dissipation device with guilding lines and soldered heat pipes and manufacturing method thereof
Ming-tang Zhang, Shenzhen, CN;
Wei-hsiang Chang, Taipei Hsien, TW;
Nien-tien Cheng, Taipei Hsien, TW;
Ming-Tang Zhang, Shenzhen, CN;
Wei-Hsiang Chang, Taipei Hsien, TW;
Nien-Tien Cheng, Taipei Hsien, TW;
Furui Precise Component (Kunshan) Co., Ltd., KunShan, Jiangsu Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, New Taipei, TW;
Abstract
A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile