The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Jun. 14, 2007
Nien-tien Cheng, Taipei Hsien, TW;
Chen-shen Lin, Taipei Hsien, TW;
Zhi-ming Liu, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A mold () for manufacturing a heat dissipation apparatus () includes a movable mold () and a fixed mold () covering the movable mold. The heat dissipation apparatus includes a plurality of fins (). One of the movable mold and the fixed mold includes an insert group (). The insert group includes a plurality of separated inserts () stacked together. A plurality of compartments () are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.