The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2011

Filed:

Jul. 15, 2009
Applicants:

Jui-wen Hung, Taipei Hsien, TW;

Nien-tien Cheng, Taipei Hsien, TW;

Ping-yang Chuang, Taipei Hsien, TW;

Inventors:

Jui-Wen Hung, Taipei Hsien, TW;

Nien-Tien Cheng, Taipei Hsien, TW;

Ping-Yang Chuang, Taipei Hsien, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.


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