Foxconn Technology Co., Ltd.

Furui Precise Component (kunshan) Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Nien-Tien Cheng

Yue Liu

Chen-Shen Lin

Ming-Hsiu Chung

Wei-Hsiang Chang

Sheng-Lin Wu

Ching-Tai Cheng

Ming-Tang Zhang

Ching-Bai Hwang

Jui-Wen Hung

Ping-Yang Chuang

Yung-Fa Cheng

Rung-An Chen

Sheng-Liang Dai

Jin-Peng Liu

Sheng-Guo Zhou

Zhi-Hui Zhao

Chih-Jen Liu

Cheng-Jen Liang

Yu-Liang Lo

Zhi-Ming Liu

Wen-Hu Chen

An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.

Flat heat pipe

A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.

Heat dissipating assembly and mold having the same

An exemplary heat dissipation fan includes a housing and an impeller. The housing includes a casing. The casing includes a bottom wall and a side wall extending upwardly from the bottom wall. The impeller is received in the housing. The impeller includes a hub and a plurality of blades extending radially and outwardly from the hub. Each blade has a distal end facing the side wall of the casing. The inner side of the side wall depressed towards an outer side of the casing.

Heat dissipation fan

A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe.

Manufacturing method of casing of heat pipe

An exemplary injection molding apparatus includes a first mold defining a passage therein, a second mold engaging with the first mold, working fluid received in the passage of the first mold, and a thermal conductive member engaged in the first mold and thermally interconnecting the first mold and the working fluid. The first mold and the second mold cooperatively define a molding chamber therebetween adapted to receive injected molten material therein. The thermal conductive member transfers heat from the first and second molds to the working fluid when the first and second molds are hotter than the working fluid, and transfers heat from the working fluid to the first and second molds when the working fluid is hotter than the first and second molds.

Injection molding apparatus having a thermostat assembly

An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.

Flat heat pipe and method for manufacturing the same

A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.

Heat pipe including a main wick structure and at least one auxiliary wick structure

An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipes

A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Heat dissipation device with guiding line and soldered heat pipe

An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer.

Heat dissipation device

A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Heat dissipation device with guilding lines and soldered heat pipes and manufacturing method thereof

An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.

Portable electronic device incorporating extendable thermal module

An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Portable electronic device incorporating extendable heat dissipation device

A mold () for manufacturing a heat dissipation apparatus () includes a movable mold () and a fixed mold () covering the movable mold. The heat dissipation apparatus includes a plurality of fins (). One of the movable mold and the fixed mold includes an insert group (). The insert group includes a plurality of separated inserts () stacked together. A plurality of compartments () are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.

Mold for manufacturing heat dissipation apparatus

A thermal interface material () includes 100 parts by weight of a silicone oil () and 800&#x2dc;1200 parts by weight of a metal powder () mixed into the silicone oil. An outer surface of each metal particle () of the metal powder is coated with a metal oxide layer (). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300&#xb0; C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.

Growing community of inventors

Taipei Hsien, Taiwan

Nien-Tien Cheng