Naomi Masuda

Title: Innovations of Naomi Masuda

Introduction

Naomi Masuda is a prominent inventor based in Kanagawa, Japan. She has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. Her work has advanced the development of semiconductor devices and packaging methods, showcasing her expertise and innovative spirit.

Latest Patents

Among her latest patents is a semiconductor device and method for manufacturing it. This invention includes a first semiconductor chip with a first electrode formed on it, a second semiconductor chip to which the first chip is mounted, and a second electrode with a protrusion. A solder bump bonds the first and second electrodes, covering part of the protrusion's side surface. Another notable patent involves structures and methods for stack type semiconductor packaging. This invention features a semiconductor chip mounted onto a substrate, with a first resin molding portion sealing the chip and a through metal piercing the resin around the chip. An upper metal is electrically coupled with the through metal, forming an integral structure that enhances the device's functionality.

Career Highlights

Naomi has worked with notable companies in the semiconductor industry, including Spansion LLC and Cypress Semiconductor Corporation. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking technologies.

Collaborations

Naomi has collaborated with esteemed colleagues such as Masataka Hoshino and Koji Taya. These partnerships have fostered innovation and have been instrumental in her successful projects.

Conclusion

Naomi Masuda's contributions to semiconductor technology through her patents and collaborations highlight her as a leading figure in the field. Her innovative work continues to influence the industry and pave the way for future advancements.