Spansion Llc.

Cypress Semiconductor Corporation

Meiji Seika Kaisha, Ltd.

Naomi Masuda

Koji Taya

Masataka Hoshino

Ryota Fukuyama

Junichi Kasai

Kouichi Meguro

Masanori Onodera

Yasuhiro Shinma

Junji Tanaka

Makoto Suzuki

Naoyuki Nishikawa

Kazunobu Takahashi

Yuji Tabata

Kenji Asai

Masahiko Harayama

Masaharu Sugai

Jiro Tanaka

Fukuichi Ohsawa

Akihiko Ikegawa

Kozo Aoki

Nobukazu Kakui

A semiconductor device which includes a first semiconductor chip, a first electrodeformed on the first semiconductor chip, a second semiconductor chipto which the first semiconductor chipis mounted, a second electrodewith a protrusion, which is formed on the second semiconductor chip, and a solder bumpwhich bonds the first electrodeand the second electrodeto cover at least a part of a side surface of the protrusion, and a method for manufacturing thereof are provided.

Semiconductor device and method for manufacturing thereof

Methods and structures for stack type semiconductor packaging are disclosed. In one embodiment, a semiconductor device includes a semiconductor chip mounted onto a substrate, a first resin molding portion formed on the substrate for sealing the semiconductor chip, and a through metal mounted on the substrate so as to pierce the first resin molding portion around the semiconductor chip. The semiconductor device further comprises an upper metal electrically coupled with the through metal and mounted on the first resin molding portion to extend from the through metal toward the semiconductor chip along an upper surface of the first resin molding portion, where the through metal and the upper metal are formed into an integral structure.

Structures and methods for stack type semiconductor packaging

A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.

Flip-chip package covered with tape

The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device.

Semiconductor device and method of manufacturing the same

The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripheral edge of a surface of the semiconductor chip opposite one surface thereof onto which connection terminals are provided is removed. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip.

Flip chip bonded semiconductor device with shelf

A semiconductor device includes a semiconductor chip, a connection electrode including a first land electrode electrically coupled with the semiconductor chip, and a through electrode formed on an upper surface of the first land electrode to be electrically coupled with the first land electrode using a stud bump, and a sealing resin, through which the connection electrode passes, for sealing the semiconductor chip.

Semiconductor device and method for manufacturing the same

Flip chip bonded semiconductor device with shelf and method of manufacturing thereof

A semiconductor device has a first semiconductor chipmolded with a resin, a first metalprovided in the resinin a circumference of the first semiconductor chip, and being exposed on a lower surface of the resin, a second metalprovided in the resinover the first metal, and being exposed on an upper surface of the resin, and a first wirecoupling the first semiconductor chipto the first metaland the second metal. The first wireis coupled to the first metaland the second metalso as to be sandwiched therebetween.

Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.

Structure, method and system for assessing bonding of electrodes in FCB packaging

Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective on of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.

Growing community of inventors

Kanagawa, Japan

Naomi Masuda