The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Dec. 20, 2013
Applicant:
Cypress Semiconductor Corporation, San Jose, CA (US);
Inventors:
Assignee:
CYPRESS SEMICONDUCTOR CORPORATION, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/812 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83907 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01);
Abstract
A semiconductor device which includes a first semiconductor chip, a first electrodeformed on the first semiconductor chip, a second semiconductor chipto which the first semiconductor chipis mounted, a second electrodewith a protrusion, which is formed on the second semiconductor chip, and a solder bumpwhich bonds the first electrodeand the second electrodeto cover at least a part of a side surface of the protrusion, and a method for manufacturing thereof are provided.