Location History:
- Tokyo, JP (2009 - 2016)
- Kanagawa, JP (2011 - 2016)
Company Filing History:
Years Active: 2009-2016
Title: The Innovations of Masataka Hoshino
Introduction
Masataka Hoshino is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work has been instrumental in advancing semiconductor devices and packaging methods.
Latest Patents
Hoshino's latest patents include a semiconductor device and a method for manufacturing it. This semiconductor device features a first semiconductor chip with a first electrode formed on it, a second semiconductor chip to which the first chip is mounted, and a second electrode with a protrusion. A solder bump bonds the first and second electrodes, covering part of the protrusion's side surface. Additionally, he has developed structures and methods for stack-type semiconductor packaging. This innovation includes a semiconductor chip mounted onto a substrate, with a first resin molding portion sealing the chip and a through metal piercing the resin around the chip. An upper metal is electrically coupled with the through metal, forming an integral structure that enhances the device's functionality.
Career Highlights
Throughout his career, Hoshino has worked with notable companies such as Spansion LLC and Cypress Semiconductor Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Hoshino has collaborated with talented individuals in the industry, including Koji Taya and Naomi Masuda. These partnerships have fostered innovation and have been crucial in the development of his patented technologies.
Conclusion
Masataka Hoshino's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the industry and pave the way for future innovations.