The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Oct. 22, 2008
Applicants:
Naomi Masuda, Kanagawa, JP;
Masataka Hoshino, Tokyo, JP;
Ryota Fukuyama, Tokyo, JP;
Inventors:
Assignee:
Spansion LLC, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device which includes a first semiconductor chip, a first electrodeformed on the first semiconductor chip, a second semiconductor chipto which the first semiconductor chipis mounted, a second electrodewith a protrusion, which is formed on the second semiconductor chip, and a solder bumpwhich bonds the first electrodeand the second electrodeto cover at least a part of a side surface of the protrusion, and a method for manufacturing thereof are provided.