The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Apr. 25, 2008
Masataka Hoshino, Tokyo, JP;
Masahiko Harayama, Tokyo, JP;
Koji Taya, Kanagawa, JP;
Naomi Masuda, Kanagawa, JP;
Masanori Onodera, Kanagawa, JP;
Ryota Fukuyama, Tokyo, JP;
Masataka Hoshino, Tokyo, JP;
Masahiko Harayama, Tokyo, JP;
Koji Taya, Kanagawa, JP;
Naomi Masuda, Kanagawa, JP;
Masanori Onodera, Kanagawa, JP;
Ryota Fukuyama, Tokyo, JP;
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
Methods and structures for stack type semiconductor packaging are disclosed. In one embodiment, a semiconductor device includes a semiconductor chip mounted onto a substrate, a first resin molding portion formed on the substrate for sealing the semiconductor chip, and a through metal mounted on the substrate so as to pierce the first resin molding portion around the semiconductor chip. The semiconductor device further comprises an upper metal electrically coupled with the through metal and mounted on the first resin molding portion to extend from the through metal toward the semiconductor chip along an upper surface of the first resin molding portion, where the through metal and the upper metal are formed into an integral structure.