The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Jan. 27, 2011
Applicants:
Naomi Masuda, Yokohama, JP;
Kouichi Meguro, Tokyo, JP;
Inventors:
Naomi Masuda, Yokohama, JP;
Kouichi Meguro, Tokyo, JP;
Assignee:
Spansion LLC, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has a first semiconductor chipmolded with a resin, a first metalprovided in the resinin a circumference of the first semiconductor chip, and being exposed on a lower surface of the resin, a second metalprovided in the resinover the first metal, and being exposed on an upper surface of the resin, and a first wirecoupling the first semiconductor chipto the first metaland the second metal. The first wireis coupled to the first metaland the second metalso as to be sandwiched therebetween.