Murali K Narasimhan

This inventor holds 25 USPTO granted patents and 3 published patent applications, primarily in Sputter Deposition Technology. Top assignees: Applied Materials, Inc., Kla-Tencor Technologies Corporation. Active years: 1999-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Murali K Narasimhan. Retrieved from https://idiyas.com/inventor/murali-k-narasimhan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 (Patent Applications = 3)

% Patents Active = 76.0

Average Co-Inventor Count = 3.9

ph-index = 11

Forward Citations = 617(Granted Patents)

Company Filing History:

24 out of 14,433

Applied Materials, Inc.

patents

1 out of 641

Kla-Tencor Technologies Corporation

patents

Years Active: 1999-2023

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Areas of Expertise:

Sputter Deposition

Cobalt Deposition

Tungsten Metallization

Copper Target

Barrier Layers

Gas-Purged Apparatus

Thin Film Measurement

Diffusion Layers

Plasma Treatment

Magnetron Sputtering

Hardness Enhancement

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11749537 - Side storage pods, equipment front end modules, and methods for operating equipment front end modules (2023-09-05),

2. 11569102 - Oxidation inhibiting gas in a manufacturing system (2023-01-31),

3. 11244844 - High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods (2022-02-08),

4. 9305838 - BEOL interconnect with carbon nanotubes (2016-04-05),

5. 9209074 - Cobalt deposition on barrier surfaces (2015-12-08),

6. 9051641 - Cobalt deposition on barrier surfaces (2015-06-09),

7. 8835311 - High temperature tungsten metallization process (2014-09-16),

8. 8764961 - Cu surface plasma treatment to improve gapfill window (2014-07-01),

9. 8642473 - Methods for contact clean (2014-02-04),

10. 8617985 - High temperature tungsten metallization process (2013-12-31),

11. 7050160 - Process and apparatus for integrating sheet resistance measurements and reflectance measurements of a thin film in a common apparatus (2006-05-23),

12. 6432819 - Method and apparatus of forming a sputtered doped seed layer (2002-08-13),

13. 6391163 - Method of enhancing hardness of sputter deposited copper films (2002-05-21),

14. 6372301 - Method of improving adhesion of diffusion layers on fluorinated silicon dioxide (2002-04-16),

15. 6315872 - Coil for sputter deposition (2001-11-13),

Title: Innovating the Future: The Impactful Work of Murali K Narasimhan

Introduction:

Murali K Narasimhan, a prolific inventor based in San Jose, CA, has made significant contributions to the field of electronic device processing assemblies and semiconductor manufacturing systems. With a total of 25 patents to his name, Narasimhan stands out as a visionary in the tech industry.

Latest Patents:

Recent patents by Narasimhan include innovations such as side storage pods for equipment front end modules and methods for operating them. These electronic device processing assemblies feature EFEMs with attached side storage pods, enhancing efficiency and functionality in semiconductor processing systems. Additionally, his work on oxidation inhibiting gas in manufacturing systems showcases his commitment to advancing semiconductor technologies.

Career Highlights:

Narasimhan's career is marked by his tenure at KLA Corporation (formerly known as KLA-Tencor Technologies Corporation), where he has spearheaded groundbreaking research and development initiatives. His expertise in semiconductor processing systems has led to the successful implementation of innovative solutions in the industry.

Collaborations:

Narasimhan has collaborated with industry peers such as Vikram Pavate and Seshadri Ramaswami, who have shared his passion for technological advancement. Together, they have worked on projects aiming to optimize semiconductor manufacturing processes and enhance overall system performance.

Conclusion:

In conclusion, Murali K Narasimhan's inventive spirit and dedication to pushing the boundaries of technology have cemented his position as a leading figure in the field of semiconductor innovation. His contributions continue to shape the future of electronic device processing assemblies and manufacturing systems, leaving a lasting impact on the industry and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents pending: