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For the Inventor, By the Inventor

Hsin-Tien, Taiwan

Moriss Kung

USPTO Granted Patents = 42

Average Co-Inventor Count = 2.1

ph-index = 13

Forward Citations = 667(Granted Patents)


Location History:

  • Hsien-Tien, JP (2006)
  • Taipei, TW (2003 - 2007)
  • Hsin Tien, TW (2003 - 2009)
  • Taipei Hsien, TW (2004 - 2012)

Company Filing History:

goldMedal42 out of 1,963 
 
Via Technologies, Inc.
 patents

Years Active: 2003-2012

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Areas of Expertise:
Multi-Chip Package
Chip Package
Conductive Block Mounting
Thermally Enhanced Package
Integrated Circuit Package
High Density Packaging
Electrical Connection Device
Chip Scale Package
Laminated Capacitor
Hybrid Interconnect Substrate
Vertical Routing Structure
Flexible Electric-Contact Structure
42 patents (USPTO):Explore Patents
1. 8269329 - Multi-chip package (2012-09-18),
2. 7638881 - Chip package (2009-12-29),
3. 7622326 - Manufacturing process of a chip package structure (2009-11-24),
4. 7504726 - Chip and manufacturing method and application thereof (2009-03-17),
5. 7470864 - Multi-conducting through hole structure (2008-12-30),
6. 7382049 - Chip package and bump connecting structure thereof (2008-06-03),
7. 7342317 - Low coefficient of thermal expansion build-up layer packaging and method thereof (2008-03-11),
8. 7247951 - Chip carrier with oxidation protection layer (2007-07-24),
9. 7235429 - Conductive block mounting process for electrical connection (2007-06-26),
10. 7180166 - Stacked multi-chip package (2007-02-20),
11. 7176559 - Integrated circuit package with a balanced-part structure (2007-02-13),
12. 7173341 - High performance thermally enhanced package and method of fabricating the same (2007-02-06),
13. 7101781 - Integrated circuit packages without solder mask and method for the same (2006-09-05),
14. 7071569 - Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection (2006-07-04),
15. 7033917 - Packaging substrate without plating bar and a method of forming the same (2006-04-25),

Title: The Innovative Journey of Moriss Kung

Introduction: Moriss Kung, a talented inventor hailing from Hsin-Tien, Taiwan, has made significant contributions to the world of innovation with his creative mind and dedication to progress.

Latest Patents: Moriss Kung's latest patents include groundbreaking inventions in the field of renewable energy technology, specifically focusing on solar panel efficiency and energy storage solutions.

Career Highlights: Throughout his illustrious career, Moriss Kung has been recognized for his pioneering work in sustainable technologies, earning multiple awards for his innovative approach to environmental challenges.

Collaborations: Moriss Kung has collaborated with leading research institutions and universities worldwide to further advance his inventions, showcasing his commitment to pushing the boundaries of what is possible in the realm of clean energy.

Conclusion: Moriss Kung's passion for innovation and his relentless pursuit of a more sustainable future make him a true visionary in the world of inventors, leaving a lasting impact on generations to come.

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