The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Feb. 18, 2003
Applicants:
Kwun-yao Ho, Hsin-Tien, TW;
Moriss Kung, Hsin-Tien, TW;
Inventors:
Kwun-Yao Ho, Hsin-Tien, TW;
Moriss Kung, Hsin-Tien, TW;
Assignee:
Via Technologies, Inc., Taipei Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A high performance thermally enhanced package and method of fabricating the same is provided. A chip (a wire bond chip or a flip chip) and a carrier (lead frame or tape carrier) are bonded together using flip-chip technology and thermal compression. The chip and the carrier are encapsulated using a molding compound. The package has a smaller overall size and the capacity to withstand electromagnetic interference.