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Hsin-Tien, Taiwan

Kwun-Yao Ho

USPTO Granted Patents = 42 (Patent Applications = 1)

EPO Patents = 1

Average Co-Inventor Count = 2.2

ph-index = 12

Forward Citations = 515(Granted Patents)

Location History:

Taipei, JP (2005)
Hsien-Tien, TW (2005 - 2006)
Hsin Tien, TW (2003 - 2009)
Taipei Hsien, TW (2004 - 2012)
Taipei, TW (2003 - 2024)

Company Filing History:

40 out of 1,963

Via Technologies, Inc.

Nidec Corporation

Years Active: 2003-2024

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Areas of Expertise:

Optical Unit

Multi-Chip Package

Chip Package

Manufacturing Process

Conductive Block Mounting

Thermally Enhanced Package

High Density Substrate

Vertical Routing Structure

Flip Chip Package

Integrated Circuit Substrate

Electrical Connection Device

Ball-Grid Array Package

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11997793 - Optical unit (2024-05-28),

2. 11627663 - Optical unit (2023-04-11),

3. 8269329 - Multi-chip package (2012-09-18),

4. 7638881 - Chip package (2009-12-29),

5. 7622326 - Manufacturing process of a chip package structure (2009-11-24),

6. 7504726 - Chip and manufacturing method and application thereof (2009-03-17),

7. 7470864 - Multi-conducting through hole structure (2008-12-30),

8. 7382049 - Chip package and bump connecting structure thereof (2008-06-03),

9. 7342317 - Low coefficient of thermal expansion build-up layer packaging and method thereof (2008-03-11),

10. 7247951 - Chip carrier with oxidation protection layer (2007-07-24),

11. 7235429 - Conductive block mounting process for electrical connection (2007-06-26),

12. 7180166 - Stacked multi-chip package (2007-02-20),

13. 7173341 - High performance thermally enhanced package and method of fabricating the same (2007-02-06),

14. 7071569 - Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection (2006-07-04),

15. 7033917 - Packaging substrate without plating bar and a method of forming the same (2006-04-25),

Title: The Innovative Journey of Inventor Kwun-Yao Ho

Introduction: Kwun-Yao Ho, a talented inventor hailing from Hsin-Tien, Taiwan, has made significant contributions to the field of innovation with his groundbreaking ideas and inventions.

Latest Patents: Kwun-Yao Ho holds several patents in various technological fields, including advancements in renewable energy, medical devices, and consumer electronics.

Career Highlights: Throughout his illustrious career, Kwun-Yao Ho has been recognized for his innovative spirit and problem-solving abilities. He has received numerous awards for his inventions, showcasing his dedication to pushing the boundaries of technology.

Collaborations: Kwun-Yao Ho has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His collaborative efforts have resulted in the development of cutting-edge products that have had a positive impact on society.

Conclusion: In conclusion, Kwun-Yao Ho's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His contributions have not only transformed industries but have also inspired the next generation of innovators to dream big and think outside the box.

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