The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Nov. 24, 2004
Applicants:
Kwun-yao Ho, Hsin Tien, TW;
Moriss Kung, Hsin Tien, TW;
Inventors:
Kwun-Yao Ho, Hsin Tien, TW;
Moriss Kung, Hsin Tien, TW;
Assignee:
Via Technologies, Inc., Hsin Tien, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/495 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked multi-chip package comprising a substrate, a first chip, a lead frame, and a second chip is provided. The first chip is placed on and electrically connected with the substrate. The lead frame is placed on the substrate and forming a space therebeneath to accommodate the first chip. The second chip is placed to the lead frame and electrically connected with the substrate through the lead frame.