The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2008

Filed:

Sep. 19, 2005
Applicants:

Kwun-yao Ho, Hsin-Tien, TW;

Moriss Kung, Hsin-Tien, TW;

Chi-hsing Hsu, Hsin-Tien, TW;

Jimmy Hsu, Hsin-Tien, TW;

Inventors:

Kwun-Yao Ho, Hsin-Tien, TW;

Moriss Kung, Hsin-Tien, TW;

Chi-Hsing Hsu, Hsin-Tien, TW;

Jimmy Hsu, Hsin-Tien, TW;

Assignee:

VIA Technologies, Inc., Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a through hole passing therethrough. The signal lines are disposed on a portion of an inner surface of the through hole and extended through the through hole. The reference line is disposed on a portion of the inner surface of the through hole and extended through the through hole, wherein the reference line is disposed between the lines for signal. Because the signal lines are separated by the reference line, the electromagnetic coupling generated by signals can be reduced to lower the cross-talk interference between signals passing through the through hole, so as to promote the signal-transmission quality.


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