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For the Inventor, By the Inventor

Taipei, Taiwan

Chi-Hsing Hsu

This inventor holds 30 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Via Technologies, Inc.. Active years: 2003-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi-Hsing Hsu. Retrieved from https://idiyas.com/inventor/chi-hsing-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 30

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 9

Forward Citations = 452(Granted Patents)


Location History:

  • Taipei Hsein, TW (2004)
  • Taipei Hsien, TW (2003 - 2009)
  • Taipei County, TW (2009)
  • Shindian, TW (2009)
  • Hsin-Tien, TW (2006 - 2010)

Company Filing History:

goldMedal30 out of 1,976 
 
Via Technologies, Inc.
 patents

Years Active: 2003-2010

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Areas of Expertise:
Chip Package
Stacked Structure
Heat Spreader
Multi-Chip Structure
Flip-Chip Package
Circuit Substrate
Embedded Component
Thermal Management
Signal Transmission
Bumpless Package
Wafer Level Packaging
Plated Through Hole
30 patents (USPTO):Explore Patents
1. 7642634 - Chip package and stacked structure of chip packages (2010-01-05),
2. 7608923 - Electronic device with flexible heat spreader (2009-10-27),
3. 7547965 - Package and package module of the package (2009-06-16),
4. 7485974 - Chip structure with bevel pad row (2009-02-03),
5. 7470864 - Multi-conducting through hole structure (2008-12-30),
6. 7449788 - Chip structure with arrangement of side pads (2008-11-11),
7. 7382629 - Circuit substrate and method of manufacturing plated through slot thereon (2008-06-03),
8. 7378601 - Signal transmission structure and circuit substrate thereof (2008-05-27),
9. 7365418 - Multi-chip structure (2008-04-29),
10. 7361982 - Bumpless chip package (2008-04-22),
11. 7291916 - Signal transmission structure and circuit substrate thereof (2007-11-06),
12. 7253526 - Semiconductor packaging substrate and method of producing the same (2007-08-07),
13. 7230332 - Chip package with embedded component (2007-06-12),
14. 7224062 - Chip package with embedded panel-shaped component (2007-05-29),
15. 7193324 - Circuit structure of package substrate (2007-03-20),

Title: Innovator Spotlight: Chi-Hsing Hsu

Introduction:

Chi-Hsing Hsu, a prolific inventor based in Taipei Hsien, TW, has made significant contributions to the field of chip packaging and electronic devices. With an impressive portfolio of 30 patents, Hsu is known for his cutting-edge innovations in the technology industry.

Latest Patents:

Among his latest patents are advancements in chip packaging technology, including the invention of a chip package with a stacked structure. This innovative design features a dielectric layer, conductive layers, a chip, wiring layers, and conductive vias to enhance the performance and functionality of electronic devices. Additionally, Hsu's electronic device with a flexible heat spreader showcases his expertise in developing efficient and adaptable cooling solutions for electronic components.

Career Highlights:

Throughout his career, Chi-Hsing Hsu has made notable contributions to companies such as Via Technologies, Inc. and Via Technologies, Inc. His expertise in chip packaging and electronic devices has played a crucial role in advancing technology and pushing the boundaries of innovation in the industry.

Collaborations:

Hsu has collaborated with talented individuals in the field, including coworkers like Jimmy Hsu and Kenny Chang. These collaborations have led to the successful development and implementation of groundbreaking technologies in chip packaging and electronic devices, further solidifying Hsu's reputation as a visionary inventor.

Conclusion:

In conclusion, Chi-Hsing Hsu's dedication to innovation and his profound impact on the technology industry through his inventions make him a standout figure in the field of chip packaging and electronic devices. His ingenuity and collaborative spirit continue to inspire advancements in technology and shape the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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