The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Jun. 08, 2005
Chi-hsing Hsu, Taipei Hsien, TW;
Chi-Hsing Hsu, Taipei Hsien, TW;
Via Technologies, Inc., Taipei Hsien, TW;
Abstract
A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip is disposed on the first surface of the panel-shaped component, and the chip has a plurality of first pads on the active surface thereof away from the panel-shaped component. The interconnection structure is disposed on the first surface of the panel-shaped component and the active surface of the chip. The first pads of the chip may electrically connect with the electrical terminals of the panel-shaped component through the interconnection structure. Furthermore, the interconnection structure has a plurality of second pads on the surface away from the chip.