The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2008
Filed:
Mar. 14, 2005
Jimmy Hsu, Taipei Hsien, TW;
Chi-hsing Hsu, Taipei Hsien, TW;
Jimmy Hsu, Taipei Hsien, TW;
Chi-Hsing Hsu, Taipei Hsien, TW;
VIA Technologies, Inc., Taipei Hsien, TW;
Abstract
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall of a through hole in the core layer of a circuit substrate. The conductive wall has a semi-circular or a C-shaped structure. Therefore, when a signal passes the conductive via and the via land of the circuit substrate through the conductive wall in the interior of the via, because of a more continuous impedance between the via land and the conductive wall, signal reflection due to impedance mismatch along the signal transmission pathway can be reduced to enhance signal transmission quality.