The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Sep. 22, 2006
Chi-hsing Hsu, Taipei Hsien, TW;
Chi-Hsing Hsu, Taipei Hsien, TW;
VIA Technologies, Inc., Taipei Hsien, TW;
Abstract
A multi-chip structure at least including a first chip, a second chip and a first thermal-conductive layer is provided. The first chip has a first surface and a plurality of first pads disposed on the first surface. The second chip has a second surface facing the first surface and a plurality of second pads disposed on the second surface. The first thermal-conductive layer is disposed between the first chip and the second chip and includes a thermal-conductive area, a plurality of first electrical connection members and a plurality of first dielectric areas. The first electrical connection members disposed in the first thermal-conductive layer are used to electrically connect the first surface and the second surface. The first dielectric areas surround and insulate the first electrical connection members from the thermal-conductive area.