The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
Nov. 04, 2004
Applicants:
Kwun-yao Ho, Hsin Tien, TW;
Moriss Kung, Hsin Tien, TW;
Inventors:
Kwun-Yao Ho, Hsin Tien, TW;
Moriss Kung, Hsin Tien, TW;
Assignee:
Via Technologies, Inc., Hsien Tien, Taipei Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 21/44 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
A build-up layer packaging comprising a first ceramic substrate, a second ceramic substrate, and a circuit layer is provided. The first ceramic substrate has a through hole to dispose a die therein. The second ceramic substrate, attached to a common lower surface of the ceramic substrate and the die, further has a plurality of openings to expose the pads of the die. The openings are filled with plugs electrically connecting to the pads. The circuit layer is formed under the second ceramic substrate to transmit signals generated by the die outward.