The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Sep. 08, 2006
Kwun-yao Ho, Taipei Hsien, TW;
Moriss Kung, Taipei Hsien, TW;
Wen-yuan Chang, Taipei Hsien, TW;
Hsueh Chung Shelton LU, Taipei Hsien, TW;
Kwun-Yao Ho, Taipei Hsien, TW;
Moriss Kung, Taipei Hsien, TW;
Wen-Yuan Chang, Taipei Hsien, TW;
Hsueh Chung Shelton Lu, Taipei Hsien, TW;
VIA Technologies, Inc., Taipei Hsien, TW;
Abstract
The present invention provides a chip and its manufacturing methods and applications. Regarding the chip, there are several solder bumps on the backside of the chip. The difference of the invented chip from the convention chips is that the solder bumps are embedded in an insulting layer and a thermal-plastic material layer of the invented chip backside and separated by a conductive layer from the insulting layer and thermal-plastic material layer. Additionally, there are some end members in the insulting layer, and the end member corresponds to one solder bump. Through the present invention, chips with different functions can be integrated together, so that the needs for having portable communication devices lighter and smaller would be met.