The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Aug. 13, 2002
Applicants:
Kun-yao Ho, Taipei, TW;
Moriss Kung, Taipei, TW;
Inventors:
Kun-Yao Ho, Taipei, TW;
Moriss Kung, Taipei, TW;
Assignee:
Via Technologies, Inc., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder wettable metal is used as the material of the first solder pad and a non-wettable insulating layer is formed on the top surface and sidewalls of the metal layer, which is not solder pads, in the integrated circuit packages without a solder mask of the present invention to avoid short circuit defects and to increase a circuit density and reliability of the integrated circuit packages.