Kun-Yao Ho

Title: Kun-Yao Ho: Innovator in Integrated Circuit Technology

Introduction

Kun-Yao Ho is a prominent inventor based in Taipei, Taiwan. He is known for his significant contributions to the field of integrated circuit technology. His innovative approach has led to advancements that enhance the reliability and efficiency of electronic devices.

Latest Patents

Kun-Yao Ho holds a patent for an "Integrated circuit packages without solder mask and method for the same." This invention focuses on an integrated circuit package that eliminates the need for a solder mask. By utilizing a solder wettable metal for the first solder pad and forming a non-wettable insulating layer on the top surface and sidewalls of the metal layer, this invention effectively prevents short circuit defects. It also increases circuit density and reliability in integrated circuit packages.

Career Highlights

Kun-Yao Ho is currently employed at Via Technologies, Inc., where he continues to push the boundaries of integrated circuit design. His work has been instrumental in developing new methods that improve the performance of electronic components.

Collaborations

He collaborates with various professionals in the industry, including his coworker Moriss Kung, to further enhance the innovation process and bring new ideas to fruition.

Conclusion

Kun-Yao Ho's contributions to integrated circuit technology exemplify the spirit of innovation. His patent reflects a commitment to improving electronic device reliability and efficiency. His work continues to influence the field and inspire future advancements.