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Mitsuru Kimura

USPTO Granted Patents = 10 (Patent Applications = 2)

Average Co-Inventor Count = 2.5

ph-index = 6

Forward Citations = 140(Granted Patents)

Company Filing History:

10 out of 35,658

Nec Corporation

Tokyo Ohka Kogyo Co., Ltd.

where one patent can have more than one assignee

Years Active: 1986-1998

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5757062 - Ceramic substrate for semiconductor device (1998-05-26),

2. 5728470 - Multi-layer wiring substrate, and process for producing the same (1998-03-17),

3. 5714112 - Process for producing a silica sintered product for a multi-layer wiring (1998-02-03),

4. 5576518 - Via-structure of a multilayer interconnection ceramic substrate (1996-11-19),

5. 5545281 - Method of bonding circuit boards (1996-08-13),

6. 5506058 - Mutlilayer glass ceramic substrate and method of fabricating the same (1996-04-09),

7. 5485352 - Element joining pad for semiconductor device mounting board (1996-01-16),

8. 5318651 - Method of bonding circuit boards (1994-06-07),

9. 4874721 - Method of manufacturing a multichip package with increased adhesive (1989-10-17),

10. 4594473 - Substrate having at least one fine-wired conductive layer (1986-06-10),

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