The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 1996
Filed:
May. 12, 1995
Applicant:
Inventors:
Akinobu Shibuya, Tokyo, JP;
Mitsuru Kimura, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174264 ; 174265 ; 174262 ;
Abstract
A via-structure off a multilayer interconnection ceramic substrate for a multi-chip module, a semiconductor package and an insulating substrate has a high strength and a high reliability being produced at a low cost. A gap is provided at an interface between a via-conductor and ceramics, and filled with a resin. The resin is preferably of a thermosetting polyimide resin or a benzo-cyclo-butene resin.