The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 1996

Filed:

Mar. 25, 1994
Applicant:
Inventors:

Koji Matsui, Tokyo, JP;

Mitsuru Kimura, Tokyo, JP;

Kazuaki Utsumi, Tokyo, JP;

Eiichi Ogawa, Kanagawa, JP;

Hiroshi Komano, Kanagawa, JP;

Toshimi Aoyama, Kanagawa, JP;

Assignees:

NEC Corporation, Tokyo, JP;

Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B32B / ; H05K / ;
U.S. Cl.
CPC ...
1562737 ; 1562755 ; 1562757 ; 156330 ; 29830 ; 29832 ; 29840 ;
Abstract

An integrated circuit connecting method that includes connecting electrode pads on an integrated circuit device to electrode terminals on a base with metal bumps interposed, the electrode terminals being formed in registry with the electrode pads. The method includes the steps of forming metal bumps on a surface of at least one of the electrode pads and the electrode terminals; covering the surface on at least one of the integrated circuit device side and the base side with a resin that cures upon exposure to active energy rays; patterning the resin to strip selectively the coating of the resin over one of the electrode pads and the electrode terminals; bringing the electrode pads and the electrode terminals into a face-to-face relationship, allowing the metal bumps to contact one of the opposing electrode pads and electrode terminals, performing thermocompressing so that the resin coating will adhere closely to one of the integrated circuit device and the base while, at the same time, the electrode pads are connected to the electrode terminals with the metal bumps interposed; and performing at least one of heat treatment and exposure to active energy rays.


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