The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 1996
Filed:
Dec. 16, 1994
Applicant:
Inventors:
Akinobu Shibuya, Tokyo, JP;
Mitsuru Kimura, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361771 ; 174257 ; 174260 ; 361767 ;
Abstract
An element joining pad for a semiconductor device mounting board includes a thick-film metalized layer, a barrier layer, and a Ni plating layer. The thick-film metalized layer is selectively formed on a low-temperature sintered board and consists of one of a metal and an alloy which can be sintered at 500.degree. C. or more and 1,200.degree. C. or less. The barrier layer is formed on the thick-film metalized layer and constituted by one of a Rh plating layer and a Ru plating layer. The Ni plating layer is formed on the barrier layer.