logo

For the Inventor, By the Inventor

Chu-Pei, Taiwan

Minghsing Tsai

This inventor holds 33 USPTO granted patents and 1 published patent application, primarily in Semiconductor Fabrication. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Minghsing Tsai. Retrieved from https://idiyas.com/inventor/minghsing-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 

% Patents Active = 66.7

Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 113(Granted Patents)


Location History:

  • Taipei, TW (2003 - 2006)
  • Chu-Pai, TW (2010)
  • Hsinchu County, TW (2014)
  • Chu-Pei, TW (2007 - 2022)

Company Filing History:

goldMedal33 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2003-2022

Loading Chart...
Areas of Expertise:
Electro-Plating
Interconnect Structure
Semiconductor Fabrication
Dual Damascene Process
Copper Line Resistivity
MIM Capacitor
Pattern Formation
Metallization Processing
Stress-Controlled Formation
Conductive Polymer Layer
Cap Layer
Passivation Method
33 patents (USPTO):Explore Patents
1. 11535950 - Electro-plating and apparatus for performing the same (2022-12-27),
2. 10985054 - Interconnect structure and method of forming the same (2021-04-20),
3. 10714383 - Interconnect structure and method of forming the same (2020-07-14),
4. 10508356 - Electro-plating and apparatus for performing the same (2019-12-17),
5. 10290538 - Interconnect structure and method of forming the same (2019-05-14),
6. 9892960 - Interconnect structure and method of forming the same (2018-02-13),
7. 9518334 - Electro-plating and apparatus for performing the same (2016-12-13),
8. 9401329 - Interconnect structure and method of forming the same (2016-07-26),
9. 9214383 - Method of semiconductor integrated circuit fabrication (2015-12-15),
10. 9142450 - Interconnect structure and method of forming the same (2015-09-22),
11. 9029260 - Gap filling method for dual damascene process (2015-05-12),
12. 8980745 - Interconnect structures and methods of forming same (2015-03-17),
13. 8975187 - Stress-controlled formation of tin hard mask (2015-03-10),
14. 8962484 - Method of forming pattern for semiconductor device (2015-02-24),
15. 8759975 - Approach for reducing copper line resistivity (2014-06-24),

Title: Innovations from Minghsing Tsai: Pioneering Advances in Semiconductor Technology

Introduction

Minghsing Tsai is a prominent inventor based in Chu-Pei, Taiwan. With an impressive portfolio of 33 patents, he has made significant contributions to the field of semiconductor technology. His work focuses on innovative methods and apparatus that enhance production processes in the electronics industry.

Latest Patents

Among his latest innovations, Tsai has developed two notable patents. The first is titled "Electro-plating and Apparatus for Performing the Same." This invention outlines a method of plating a metal layer on a work piece, utilizing a unique voltage system that distinguishes between the edge and inner portions of the work piece. The plating solution plays a crucial role in this process, enabling efficient metal deposition.

The second patent, "Interconnect Structure and Method of Forming the Same," presents an advanced interconnect structure that incorporates several layered components. This structure features a lower etch stop layer (ESL), a low-k dielectric layer, and a unique conductive feature that includes both a first metal line and a dummy via. These elements work together to improve the reliability and functionality of semiconductor devices.

Career Highlights

Minghsing Tsai is currently affiliated with Taiwan Semiconductor Manufacturing Company Ltd., a leading player in the semiconductor industry. His role as an inventor reflects his commitment to advancing technology within this vital sector.

Collaborations

Tsai has collaborated with esteemed colleagues, including Hung-Wen Su and Chih-Yuan Ting. Together, they contribute to the innovative environment at Taiwan Semiconductor Manufacturing Company, driving forward the boundaries of semiconductor manufacturing and design.

Conclusion

Through his patents and collaborations, Minghsing Tsai has established himself as a key innovator in semiconductor technology. His work continues to propel advancements in the industry, showcasing the important intersection of creativity and engineering that drives innovation forward.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…