The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Mar. 08, 2013
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Jeng-Shiou Chen, Kaohsiung, TW;
Chih-Yuan Ting, Taipei, TW;
Jyu-Horng Shieh, Hsin-Chu, TW;
Minghsing Tsai, Chu-Pei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a first metal line and a second metal line over a substrate; a portion of a first low-k (LK) dielectric layer between the first metal line and the second metal line; and a second LK dielectric layer over the portion of the first LK dielectric layer. A top surface of the second LK dielectric layer is substantially coplanar with a top surface of the first metal line or the second metal line, and a thickness of the second LK dielectric layer is less than a thickness of the first metal line or a thickness of the second metal line.