Ming-Ji Dai

This inventor holds 29 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignee: Industrial Technology Research Institute. Active years: 2009-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Ji Dai. Retrieved from https://idiyas.com/inventor/ming-ji-dai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 (Patent Applications = 9)

% Patents Active = 65.5

Average Co-Inventor Count = 3.9

ph-index = 7

Forward Citations = 201(Granted Patents)

Location History:

Chiayi County, TW (2009 - 2012)
Dongshih Township, TW (2012)
Hsinchu, TW (2011 - 2021)

Company Filing History:

29 out of 9,307

Industrial Technology Research Institute

patents

Years Active: 2009-2021

Loading Chart...

Areas of Expertise:

Chip Stacking

Heat Dissipation

Light Emitting Diode

Thermoelectric Device

Electronic Packaging

Measurement Apparatus

Circuit Board Structure

Backside Illumination

Self-Assembly

Integrated Package

Pressure Sensor

Thermal Management

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11132786 - Board defect filtering method based on defect list and circuit layout image and device thereof and computer-readable recording medium (2021-09-28),

2. 10540474 - Chip temperature computation method and chip temperature computation device (2020-01-21),

3. 10343868 - Roller with pressure sensor and R to R device (2019-07-09),

4. 10288696 - Intelligent diagnosis system for power module and method thereof (2019-05-14),

5. 9448121 - Measurement method, measurement apparatus, and computer program product (2016-09-20),

6. 9130080 - Encapsulation of backside illumination photosensitive device (2015-09-08),

7. 8674491 - Semiconductor device (2014-03-18),

8. 8664509 - Thermoelectric apparatus and method of fabricating the same (2014-03-04),

9. 8609454 - Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices (2013-12-17),

10. 8552554 - Heat dissipation structure for electronic device and fabrication method thereof (2013-10-08),

11. 8536701 - Electronic device packaging structure (2013-09-17),

12. 8519524 - Chip stacking structure and fabricating method of the chip stacking structure (2013-08-27),

13. 8507909 - Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor (2013-08-13),

14. 8502224 - Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor (2013-08-06),

15. 8456017 - Filled through-silicon via with conductive composite material (2013-06-04),

Title: Innovator Spotlight: Ming-Ji Dai, Pioneering Inventor from Hsinchu

Introduction:

Meet Ming-Ji Dai, a brilliant inventor based in Hsinchu, Taiwan. With a remarkable track record and 29 patents to his name, he is an esteemed figure in the field of technological innovations.

Latest Patents:

Among his latest patents is a cutting-edge "Board Defect Filtering Method based on Defect List and Circuit Layout Image and Device Thereof." This method revolutionizes defect filtering processes in manufacturing by utilizing defect images and circuit layout analysis. Additionally, Dai has developed a "Chip Temperature Computation Method and Chip Temperature Computation Device," showcasing his expertise in thermal resistance computation and chip temperature analysis.

Career Highlights:

Ming-Ji Dai is a valuable asset at the Industrial Technology Research Institute, where he channels his creativity and expertise into groundbreaking projects. His contributions have significantly impacted the industry, setting new standards for innovation and excellence.

Collaborations:

Dai collaborates closely with esteemed colleagues such as Chun-Kai Liu and Ra-Min Tain, fostering a culture of teamwork and idea exchange. Together, they form a dynamic team driving technological advancements and pushing boundaries in research and development.

Conclusion:

In conclusion, Ming-Ji Dai stands out as a visionary inventor whose relentless dedication to technological advancement has earned him a well-deserved reputation as a trailblazer in the field. His innovative patents and collaborative spirit continue to inspire and shape the future of innovation.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

9 patents pending: