The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Dec. 08, 2010
Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
Ra-min Tain, Taipei County, TW;
John H. Lau, Taipei, TW;
Ming-che Hsieh, Kaohsiung, TW;
Wei LI, Hsinchu, TW;
Ming-ji Dai, Hsinchu, TW;
Ra-Min Tain, Taipei County, TW;
John H. Lau, Taipei, TW;
Ming-Che Hsieh, Kaohsiung, TW;
Wei Li, Hsinchu, TW;
Ming-Ji Dai, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface.