The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Jul. 01, 2011
Ming-ji Dai, Hsinchu, TW;
Heng-chieh Chien, New Taipei, TW;
Ming-che Hsieh, Kaohsiung, TW;
Jui-feng Hung, Taichung, TW;
Ra-min Tain, New Taipei, TW;
John H. Lau, Taipei, TW;
Ming-Ji Dai, Hsinchu, TW;
Heng-Chieh Chien, New Taipei, TW;
Ming-Che Hsieh, Kaohsiung, TW;
Jui-Feng Hung, Taichung, TW;
Ra-Min Tain, New Taipei, TW;
John H. Lau, Taipei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
By adding particles of high thermal conductivity and low thermal expansion coefficient into the copper as a composite material and filling with the composite material into the through-via hole, the mismatch of the coefficient of thermal expansion and the stress of the through-silicon via are lowered and the thermal conductivity of the through-silicon via is increased.