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For the Inventor, By the Inventor

Taipei, Taiwan

Heng-Chieh Chien

USPTO Granted Patents = 14

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 110(Granted Patents)


Location History:

  • Taipei County, TW (2011)
  • Hsinchu, TW (2019)
  • Miaoli County, TW (2020)
  • New Taipei, TW (2013 - 2024)

Company Filing History:

goldMedal14 out of 9,138 
 
Industrial Technology Research Institute
 patents
silverMedal1 out of 2 
 
Kenmec Mechanical Engineering Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2011-2025

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14 patents (USPTO):
1. 12401109 - Antenna-in-package with heat dissipation structure (2025-08-26),
2. 12352501 - Radiators and immersion tanks using the same (2025-07-08),
3. 11942396 - Heterogeneous integration semiconductor package structure (2024-03-26),
4. 11602128 - Ear tag module (2023-03-14),
5. 10540474 - Chip temperature computation method and chip temperature computation device (2020-01-21),
6. 10197255 - Rail-type OLED lamp assembly (2019-02-05),
7. 10051742 - Power module and manufacturing method thereof (2018-08-14),
8. 9448121 - Measurement method, measurement apparatus, and computer program product (2016-09-20),
9. 9418921 - Power module (2016-08-16),
10. 9252054 - Thinned integrated circuit device and manufacturing process for the same (2016-02-02),
11. 8609454 - Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices (2013-12-17),
12. 8519524 - Chip stacking structure and fabricating method of the chip stacking structure (2013-08-27),
13. 8456017 - Filled through-silicon via with conductive composite material (2013-06-04),
14. 8075182 - Apparatus and method for measuring characteristic and chip temperature of LED (2011-12-13),

Title: **Innovative Contributions of Heng-Chieh Chien**

Introduction

Heng-Chieh Chien is a prominent inventor based in New Taipei, Taiwan, with a remarkable portfolio of 12 patents. His contributions to the field of semiconductor technology and wearable devices emphasize his dedication to advancing innovation. Chien's expertise lies in creating sophisticated solutions that improve efficiency and functionality in various applications.

Latest Patents

Among his latest innovations, Chien has developed a **Heterogeneous Integration Semiconductor Package Structure**. This unique design incorporates a heat dissipation assembly and multiple chips, ensuring efficient thermal management and improved device performance. The assembly features a two-phase flow heat dissipation device and a first redistribution structure layer, allowing enhanced electrical connections among the components.

Another notable invention from Chien is the **Ear Tag Module**, which is designed for accurate temperature monitoring. This module includes a rod member, a spike for insertion, a circuit component, and a temperature sensor. Upon penetration, the temperature sensor detects the ear's temperature and transmits this data, facilitating real-time health monitoring.

Career Highlights

Chien's professional background is anchored at the Industrial Technology Research Institute, where he has played a vital role in pioneering novel technologies. His hands-on experience and inventive mindset have led to significant advancements in both semiconductor packaging and smart wearable devices.

Collaborations

Throughout his career, Chien has collaborated with notable colleagues, including Yu-Lin Chao and Ming-Ji Dai. These partnerships foster a creative environment that bolsters innovation and leads to impactful technological advancements.

Conclusion

Heng-Chieh Chien's contributions to technology showcase his ingenuity and commitment to innovation. With a robust patent portfolio and a collaborative spirit, he continues to inspire future advancements in semiconductor technology and smart devices.

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