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Toufen, Taiwan

Ming Hung Tseng

USPTO Granted Patents = 71 

Average Co-Inventor Count = 5.7

ph-index = 9

Forward Citations = 233(Granted Patents)

DiyaCoin DiyaCoin = 0.32 


Inventors with similar research interests:


Location History:

  • Toufen Township, TW (2011 - 2024)
  • Miaoli County, TW (2016 - 2024)

Company Filing History:

goldMedal71 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

71 patents (USPTO):
1. 12438007 - Staggered metal mesh on backside of device die and method forming same (2025-10-07),
2. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),
3. 12288729 - Integrated circuit package and method (2025-04-29),
4. 12255184 - Semiconductor packages and methods of forming the same (2025-03-18),
5. 12159839 - Semiconductor packages (2024-12-03),
6. 12087597 - Semiconductor structure comprising various via structures (2024-09-10),
7. 12002799 - Die stacking structure and method forming same (2024-06-04),
8. 11996227 - Hexagonal semiconductor package structure (2024-05-28),
9. 11942433 - Integrated circuit package and method (2024-03-26),
10. 11935804 - Integrated circuit package and method (2024-03-19),
11. 11848288 - Semiconductor device and method (2023-12-19),
12. 11715646 - Semiconductor structure and method for forming the same (2023-08-01),
13. 11682655 - Semiconductor packages and methods of forming the same (2023-06-20),
14. 11631993 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2023-04-18),
15. 11626339 - Integrated circuit package and method (2023-04-11),

As an AI assistant specialized in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can provide you with an article about inventor Ming Hung Tseng based on the given data.

Title: Unveiling the Innovations of Ming Hung Tseng in Integrated Circuits

Introduction:

Ming Hung Tseng, a prolific inventor hailing from Toufen Township, TW, is a visionary in the field of integrated circuits. With an impressive portfolio of 63 patents, his contributions have greatly impacted the technological landscape.

Latest Patents:

Among Tseng's latest patents is an innovative integrated circuit package and method. This cutting-edge structure revolutionizes the connectivity and encapsulation of integrated circuit dies, paving the way for enhanced performance and efficiency in electronics.

Career Highlights:

Tseng's career is marked by his tenure at Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a renowned leader in semiconductor technology. His expertise and relentless pursuit of innovation have been instrumental in advancing the capabilities of integrated circuits.

Collaborations:

Collaborating with industry peers is crucial in driving innovation forward. Tseng has had the privilege of working alongside esteemed colleagues such as Hao-Yi Tsai and Chen-Hua Douglas Yu. Together, they have pushed the boundaries of integrated circuit design and manufacturing.

Conclusion:

In conclusion, Ming Hung Tseng stands as a trailblazer in the realm of integrated circuits, with a remarkable array of patents that showcase his ingenuity and dedication to technological advancement. His contributions continue to shape the future of electronics, inspiring generations of inventors to come.

If you would like more information or details on Ming Hung Tseng's inventions, patents, or collaborations, feel free to explore our website idiyas.com for further insights.

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