Ming Hung Tseng

This inventor holds 71 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2025.

USPTO Granted Patents = 71 (Patent Applications = 13)

% Patents Active = 91.5

Average Co-Inventor Count = 5.7

ph-index = 9

Forward Citations = 236(Granted Patents)

Forward Citations (Not Self Cited) = 209(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Toufen Township, TW (2011 - 2024)
Miaoli County, TW (2016 - 2024)

Company Filing History:

71 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2011-2025

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Areas of Expertise:

Semiconductor Package

Die Stacking

Hexagonal Structure

Wireless Charging

Integrated Circuit

Conductive Vias

Dielectric Slots

InFO Coil

Stacked Coil

Thermal Management

Via Structures

Substrate Pad

71 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12438007 - Staggered metal mesh on backside of device die and method forming same (2025-10-07),

2. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),

3. 12288729 - Integrated circuit package and method (2025-04-29),

4. 12255184 - Semiconductor packages and methods of forming the same (2025-03-18),

5. 12159839 - Semiconductor packages (2024-12-03),

6. 12087597 - Semiconductor structure comprising various via structures (2024-09-10),

7. 12002799 - Die stacking structure and method forming same (2024-06-04),

8. 11996227 - Hexagonal semiconductor package structure (2024-05-28),

9. 11942433 - Integrated circuit package and method (2024-03-26),

10. 11935804 - Integrated circuit package and method (2024-03-19),

11. 11848288 - Semiconductor device and method (2023-12-19),

12. 11715646 - Semiconductor structure and method for forming the same (2023-08-01),

13. 11682655 - Semiconductor packages and methods of forming the same (2023-06-20),

14. 11631993 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2023-04-18),

15. 11626339 - Integrated circuit package and method (2023-04-11),

As an AI assistant specialized in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can provide you with an article about inventor Ming Hung Tseng based on the given data.

Title: Unveiling the Innovations of Ming Hung Tseng in Integrated Circuits

Introduction:

Ming Hung Tseng, a prolific inventor hailing from Toufen Township, TW, is a visionary in the field of integrated circuits. With an impressive portfolio of 63 patents, his contributions have greatly impacted the technological landscape.

Latest Patents:

Among Tseng's latest patents is an innovative integrated circuit package and method. This cutting-edge structure revolutionizes the connectivity and encapsulation of integrated circuit dies, paving the way for enhanced performance and efficiency in electronics.

Career Highlights:

Tseng's career is marked by his tenure at Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a renowned leader in semiconductor technology. His expertise and relentless pursuit of innovation have been instrumental in advancing the capabilities of integrated circuits.

Collaborations:

Collaborating with industry peers is crucial in driving innovation forward. Tseng has had the privilege of working alongside esteemed colleagues such as Hao-Yi Tsai and Chen-Hua Douglas Yu. Together, they have pushed the boundaries of integrated circuit design and manufacturing.

Conclusion:

In conclusion, Ming Hung Tseng stands as a trailblazer in the realm of integrated circuits, with a remarkable array of patents that showcase his ingenuity and dedication to technological advancement. His contributions continue to shape the future of electronics, inspiring generations of inventors to come.

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