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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11996227 B1

PDFFull Text
Date of Patent:
May. 28, 2024

Filed:

Dec. 13, 2022

Hexagonal semiconductor package structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzu-Sung Huang, Tainan, TW;

Chen-Hua Yu, Hsinchu, TW;

Hao-Yi Tsai, Hsinchu, TW;

Hung-Yi Kuo, Taipei, TW;

Ming Hung Tseng, Toufen Township, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Hal Kaplan

Assistant Examiner:

Rasem Mourad

Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 38/14 (2006.01); H01F 41/04 (2006.01); H01F 41/10 (2006.01); H01L 49/02 (2006.01); H02J 50/10 (2016.01); H02J 50/80 (2016.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 38/14 (2013.01); H01F 41/041 (2013.01); H01F 41/10 (2013.01); H01L 28/10 (2013.01); H02J 50/10 (2016.02); H02J 50/80 (2016.02); H01F 2017/0086 (2013.01);
Abstract

Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

Find Patent Forward Citations

Huang, Tzu-Sung. (2024). Hexagonal semiconductor package structure (U.S. Patent No. 11996227). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11996227

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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