IDiyas

For the Inventor, By the Inventor

Tainan, Taiwan

Ming-Che Lee

USPTO Granted Patents = 12

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:

goldMedal12 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2025

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12 patents (USPTO):
1. 12278151 - Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate (2025-04-14),
2. 12183779 - Integrated circuit and method of forming the same (2024-12-31),
3. 12176372 - Dielectric structure overlying image sensor element to increase quantum efficiency (2024-12-24),
4. 12087756 - Protective wafer grooving structure for wafer thinning and methods of using the same (2024-09-10),
5. 11670539 - Method of making a semiconductor arrangement (2023-06-06),
6. 11664411 - Semiconductor structure having integrated inductor therein (2023-05-30),
7. 11552066 - Protective wafer grooving structure for wafer thinning and methods of using the same (2023-01-10),
8. 11189583 - Semiconductor structure and manufacturing method thereof (2021-11-30),
9. 11011600 - Semiconductor structure having integrated inductor therein (2021-05-18),
10. 10541297 - Semiconductor structure having integrated inductor therein (2020-01-21),
11. 10522487 - Semiconductor structure and manufacturing method thereof (2019-12-31),
12. 10164001 - Semiconductor structure having integrated inductor therein (2018-12-25),

Title: The Innovative Contributions of Ming-Che Lee

Introduction

Ming-Che Lee is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices, which are crucial in modern electronics.

Latest Patents

Among his latest patents is a semiconductor wafer seal ring that features a protrusion extending into a trench in the semiconductor substrate. This innovation relates to a semiconductor wafer structure that includes a semiconductor substrate and multiple semiconductor devices. The design incorporates a dielectric stack with several dielectric layers arranged over the substrate, along with a conductive interconnect structure within the dielectric stack. The seal ring layer surrounds the dielectric stack and includes a protrusion that extends into a trench in the substrate, enhancing the integrity of the semiconductor devices. Another notable patent is for an integrated circuit (IC) and the method of forming it. This IC comprises a substrate, a conductive layer, a barrier layer, and an etching stop layer, which covers the sidewall of the barrier layer. Additionally, it features at least one capacitor structure, which is essential for the performance of the integrated circuit.

Career Highlights

Ming-Che Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves research and development, where he applies his expertise to create innovative solutions that push the boundaries of semiconductor technology.

Collaborations

Ming-Che Lee has collaborated with notable colleagues such as Sheng-Chau Chen and Cheng-Yuan Tsai. Their combined efforts contribute to the advancement of semiconductor technologies and the development of new patents.

Conclusion

Ming-Che Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the electronics industry significantly.

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